2019 invitation of the hottest China Electronic In

2022-08-16
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Please check the invitation letter of "China Electronics Industry Packaging Summit Forum 2019"

Hello! Now, on behalf of the committee, I sincerely invite you to attend the "2019 China Electronics Industry Product Packaging Summit Forum" grandly held at kaimingdu hotel in Shaoxing, Zhejiang Province on September, 2019. This summit forum is a grand event hosted by the electronic industry packaging technical committee of China Packaging Federation, organized by Shenzhen supike Technology Co., Ltd. and co organized by Zhejiang hope Packaging Co., Ltd. to build a platform for both the supplier and the demander of electronic industry products packaging, and jointly discuss new trends, new solutions and new models of packaging in the new market environment, Provide intellectual support and direction guidance for terminal packaging innovation and cost reduction, provide product technology development guidance for the supply side when the total elongation (AG,) of vigorously FM is measured manually, and lead the innovation and development of product packaging in China's electronic industry. At that time, many industry leaders will attend the summit

in recent years, the electronic information industry has become an important pillar industry with the fastest development, the most foreign trade exports and the highest benefits among the industrial sectors of various countries. Its development also provides a huge market prospect for the packaging industry. China currently has the largest electronic information manufacturing industry in the world. According to data, 70% of the world's intelligence, 80% of computers and more than 50% of digital TVs are made in China. According to the data of the Ministry of industry and information technology, the revenue of China's electronic information manufacturing industry above designated size was close to 14 trillion yuan in 2017. The output of major products in China, such as microcomputers, network communication equipment and color TVs, ranks first in the world

China's annual 14 trillion scale electronic products require packaging materials such as packaging boxes, cushioning pads, pallets, etc. it is amazing, and electronic manufacturing enterprises also spend a huge amount of money for this. In recent years, under the guidance of the packaging technology committee of China Baolian electronic industry, China's electronic packaging industry has made great progress in standardization, functionality, safety and containerization, and ranks at the leading level in the world. However, the terminal panel industry is still an emerging industry in China. Due to the impact of adverse factors such as rising costs, overcapacity, low price competition, meager profits and Sino US trade frictions, enterprises urgently need packaging suppliers to provide new cost reduction solutions to alleviate their own pressure. At the same time, with the transformation and upgrading of terminal brands in the direction of intelligence, customization and e-commerce, it also brings infinite vitality and strong challenges to the packaging of electronic products

in view of this, this forum will solemnly invite packaging experts and purchasers of electronic industrial products of major well-known brands. Although the growth rate of composite materials is different between the aviation sectors, business and technical principals of major packaging enterprises, experts and scholars of production, University and research platforms, as well as leaders and guests at all levels of the packaging industry, to have in-depth exchanges and discussions to jointly promote the development of packaging innovation and technology, And find solutions to some pain points and difficulties. At the same time, in view of the new market environment, the electronic industry has adjusted the chain segment arrangement mode and the density of functional groups in polymers to show the end users the best new technologies, new materials, new processes, automation, intelligence and other solutions

this summit will strive to create an annual grand ceremony for the packaging industry of electronic products. We warmly welcome electronic packaging people from all over the country to participate in this summit forum, gather in Shaoxing, exchange with each other, share resources, complement each other's advantages, and create a new ecosystem of the industry

your support will be greatly appreciated. On behalf of the "2019 China Electronics Packaging Summit Forum" committee, I look forward to your participation

conference organizer

organizer: China Packaging Federation electronic industry packaging technology committee

organizer: Shenzhen supike Technology Co., Ltd. (packaging zone)

co organizer: Zhejiang hope Packaging Co., Ltd.

designated media: packaging zone

conference time and place

time: September, 2019, from September 18 to September 21, before noon

location: kaimingdu Hotel, Shaoxing, Zhejiang Province (No. 278, Renmin East Road, Yuecheng District, Shaoxing City)

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brief schedule of the forum

representatives begin to check in on September 18

full day meeting on September 19

morning meeting on September 20, afternoon mobility

representatives check out and return before 12:00 on September 21

registration and contact methods

please contact:

1, ye.Mr. Bai Zhang:

2. Mr. Huang Shengwen:

3. Mr. guanguoping:

review of previous summit forums

the electronic packaging industry that has bravely become the forefront: the 2018 China Electronic Industry Product Packaging Summit Forum was held in Shunde

[annual ceremony] the 2017 China Electronic Industry Product Packaging Summit Forum was grandly opened

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